layer
|
1-36 layer
|
Max Board Size
|
1100*599mm 43.3" * 24"
|
Min Board Thickness
|
4 layer 0.40mm 16mil
|
|
6 layer 1.00mm 40mil
|
8 layer 1.20mm 48mil
|
10 layer 1.60mm 60mil
|
Max Ratio of Board thickness
and Via diameter
|
22:1
|
Min space
|
0.075mm 3mil
|
Min line width
|
0.075mm 3mil
|
Min hole size
|
0.1mm 4mil
|
Min S/M bridge
|
0.1mm 4mil
|
Plated wall thickness
|
0.025mm 1mil
|
Plated hole dia tolerance
|
±0.10mm 4mil
|
NO Plated hole dia tolerance
|
±0.05mm 2mil
|
Outline tolerance
|
±0.15mm 6mil
|
Twist and bent
|
≤1.5%
|
Board thickness tolerance
|
±10%
|
Copper weight
|
0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
|
Surface finish
|
HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
|
Board material
|
FR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
|
Insulation resistance
|
1012Ω (Normal)
|
Through hole resistance
|
300Ω(Normal)
|
Electric strength
|
1.3KV/mm
|
Current strength
|
10A
|
Peel strength
|
1.5N/mm
|
Thermal stress
|
28820 Seconds
|
Flammability
|
94V-0
|
Test voltage
|
50-300V
|
|